Tecno kc2 full dump file 100 % tested working

 Tecno kc2 full dump file 100 % tested working file

note: flash  only dump and connect ic board set is 100% on working

Connection status: EHCI:HUB: HUB[#3]: USB 2.00 High-Speed

Interface: UFI High-Speed

Serial number: 0011-8842-4844

 Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)

Insertion test... Done

Init bus...

VCC: 3.3 V, VCCQ: 3.0 V

Bus: 8 bit (HS SDR 48MHz)

Access mode: sector mode

Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)

 Card/BGA: BGA (Discrete embedded) - High density MMC

 Manufacturer ID: 0x15 (Samsung)

 Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x973A9AB9

 Manufacturing date: Dec 2019

CID: 15010047 4436424D 4201973A 9AB9C68E

CSD: D0270132 0F5903FF F6DBFFEF 8E40400C

EXT_CSD revision: 1.8 (MMC v5.1) 

Partition info:

 Boot1: 4 MiB

 Boot2: 4 MiB

 RPMB: 4 MiB [Authentication Key not yet programmed]

 User area: 29.12 GiB(31,268,536,320 bytes)

Cache size: 64 MiB

Hardware reset function: 1

Partition configuration: 0x48

 Boot acknowledge is sent during the boot operation

 Boot partition 1 is enabled for boot

Partitioning support: 0x07

 Device support partitioning feature

 Device can have enhanced technological features

 Device partitioning possible

Boot configuration protection: 0x00

Boot bus conditions: 0x02

  Bus width: x8 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)

Boot area write protection: 0x00

ANDROID System Info:

 platform: MT6761, cpu abi: arm64-v8a

 manufacturer: TECNO MOBILE LIMITED

 board: TECNO-KC2, name: H6113

 brand: TECNO, model: TECNO KC2

 build model list: TECNO KC2

 build id: PPR1.180610.011, version: 9 [Pie] (KC2-H6113AI-P-210705V320)

 build description: full_kc2_h6113-user 9 PPR1.180610.011 126295 release-keys

crypto state: encrypted?

Custom moviNAND command is not supported for this device(MMC51).

Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G

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